Through silicon vias: materials, models, design, and performance
Auteur :
Kaushik, Brajesh Kumar / Ramesh Kumar, Vobulapuram / Majumder, Manoj Kumar / Alam, Arsalan
Éditeur :
Taylor & Francis Ltd
ISBN :
9780367574543
Date de publication :
30 juin 2020
Dimensions :
23,4 x 15,6 cm
Poids :
453 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph