Microelectronic packaging
Éditeur :
Taylor & Francis Ltd
ISBN :
9780415311908
Date de publication :
20 déc. 2004
Dimensions :
23,4 x 15,6 cm
Poids :
907 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
With the advent of electrochemical processing technologies for chips metallization, there has been corresponding development of equipment compatible with semiconductor industry standards. These include high volume manufacturing tools that are