Chip on board: technology for multichip modules
Auteur :
Lau, John H.
Éditeur :
Lau, John H.
ISBN :
9780442014414
Date de publication :
1 juin 1994
Dimensions :
23,4 x 15,6 x 3,1 cm
Poids :
984 g
Format :
Laminated cover
Langue :
Anglais
Pays d'origine :
Bonaire, Saba
A guide to the COB technology. It is suitable for professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems.