Advanced electronic packaging
Éditeur :
John Wiley & Sons Inc
ISBN :
9780471466093
Date de publication :
23 mai 2006
Dimensions :
25,8 x 18,3 x 4,5 cm
Poids :
1554 g
Langue :
Anglais
Pays d'origine :
USA
This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed.W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses.