Handbook of thin film deposition techniques principles, methods, equipment and applications, second editon
Auteur :
Seshan, Krishna
Éditeur :
William Andrew Publishing
ISBN :
9780815514428
Date de publication :
1 févr. 2002
Dimensions :
22,9 x 15,2 cm
Poids :
1156 g
Langue :
Anglais
Pays d'origine :
USA
Suitable for engineers, technicians, and plant personnel in the semiconductor and related industries, this book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization.