Handbook of lead-free solder technology for microelectronic assemblies
Auteur :
Puttlitz, Karl J. / Stalter, Kathleen A.
Éditeur :
Taylor & Francis Inc
ISBN :
9780824748708
Date de publication :
27 févr. 2004
Dimensions :
25,4 x 17,8 cm
Poids :
2100 g
Langue :
Anglais
Pays d'origine :
USA
Presents a discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. This book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders.