Practical guide to the packaging of electronics: thermal and mechanical design and analysis, third edition
Auteur :
Jamnia, Ali
Éditeur :
Taylor & Francis Ltd
ISBN :
9781032097824
Date de publication :
30 juin 2021
Dimensions :
23,4 x 15,6 cm
Poids :
530 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides a basic understanding of electronics packaging design issues, updated to reflect recent developments in the field. Early chapters provide a foundation in heat transfer, vibration, and life expectancy calculations.