Recent trends in vlsi and semiconductor packaging
Éditeur :
Taylor & Francis Ltd
ISBN :
9781041017875
Date de publication :
6 mai 2025
Dimensions :
28,0 x 21,0 cm
Poids :
1200 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
The Conference aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields.