Thermal and structural electronic packaging analysis for space and extreme environments
Auteur :
Cepeda-Rizo, Juan / Gayle, Jeremiah / Ravich, Joshua
Éditeur :
Taylor & Francis Ltd
ISBN :
9781041216919
Date de publication :
24 déc. 2026
Dimensions :
23,4 x 15,6 cm
Langue :
Anglais
Pays d'origine :
Grande Bretagne
Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments has cutting-edge information on how to design, analyze, and test in the small satellite environment.