Electromigration in metals: fundamentals to nano-interconnects
Auteur :
Ho, Paul S. / Hu, Chao-Kun / Gall, Martin / Sukharev, Valeriy
Éditeur :
Cambridge University Press
ISBN :
9781107032385
Date de publication :
12 mai 2022
Dimensions :
25,0 x 17,4 x 2,4 cm
Poids :
980 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
Learn to assess electromigration reliability, and design more resilient chips, from this comprehensive resource. Building from fundamental physics to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. This is an ideal text for materials scientists and chip design engineers.