Wireless interface technologies for 3d ic and module integration
Auteur :
Kuroda, Tadahiro / Yip, Wai-Yeung
Éditeur :
Cambridge University Press
ISBN :
9781108841214
Date de publication :
30 sept. 2021
Dimensions :
25,1 x 17,7 x 2,4 cm
Poids :
752 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
Synthesising fifteen years of research, this comprehensive text provides a treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, and practical considerations. An essential resource for researchers, professional engineers and graduate students.