Information science and electronic engineering: proceedings of the 3rd international conference of electronic engineering and information science (iceeis 2016), january 4-5, 2016, harbin, china
Éditeur :
Taylor & Francis Ltd
ISBN :
9781138029873
Date de publication :
6 déc. 2016
Dimensions :
24,6 x 17,4 cm
Poids :
1040 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
The 3rd International Conference of Electronic Engineering and Information Science (ICEEIS2016) was held January 4-5, 2016 in Harbin, P.R. China. This conference is sponsored by Harbin University of Science and Technology. The topics covered at ICEEIS2016 include semiconductor materials, nano materials, mechanical materials, MEMS materials, electronic engineering, and information science.