3d integration in vlsi circuits: implementation technologies and applications
Éditeur :
Taylor & Francis Ltd
ISBN :
9781138710399
Date de publication :
24 avr. 2018
Dimensions :
23,4 x 15,6 cm
Poids :
521 g
Langue :
Anglais
Pays d'origine :
Grande Bretagne
The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs.