Fatigue life prediction of solder joints in electronic packages with ansys
Auteur :
Madenci, Erdogan
Éditeur :
Madenci, ErdoganGuven, Ibrahim,Kilic, Bahattin,
ISBN :
9781402073304
Date de publication :
31 déc. 2002
Dimensions :
23,4 x 15,6 x 1,2 cm
Poids :
1050 g
Format :
Laminated cover
Langue :
Anglais
Pays d'origine :
USA
Discusses specific steps of the analysis method through examples without leaving any room for confusion. This title allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.