Fundamentals of lead-free solder interconnect technology: from microstructures to reliability
Auteur :
Lee, Tae-Kyu / Bieler, Thomas R. / Kim, Choong-Un / Ma, Hongtao
Éditeur :
Springer-Verlag New York Inc.
ISBN :
9781489978011
Date de publication :
1 oct. 2016
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
USA
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys.