Noise coupling in system-on-chip
Éditeur :
Taylor & Francis Inc
ISBN :
9781498796774
Date de publication :
27 déc. 2017
Dimensions :
23,4 x 15,6 cm
Poids :
1120 g
Langue :
Anglais
Pays d'origine :
USA
The book presents information written by international experts in the field of Systems on Chip (SoC) Coupling, including substrate and interconnect magnetic crosstalk, 2D and 3D circuits noise coupling, and TSV and simulation. It enables the reader to analyze crosstalk noise propagating through the parasitics interconnect and package and the PCB.