Handbook of lapping and polishing
Éditeur :
Taylor & Francis Inc
ISBN :
9781574446708
Date de publication :
20 nov. 2006
Dimensions :
23,4 x 15,6 cm
Poids :
793 g
Langue :
Anglais
Pays d'origine :
USA
Describes the most precise processes available for finishing the surfaces of mechanical as well as electronics and semiconductor components. This book presents an introduction focused on the fundamental concepts and the basics of lapping and polishing processes. It builds on this foundation to discuss lapping of ductile and brittle materials.