Handbook of semiconductor interconnection technology
Auteur :
Shwartz, Geraldine Cogin
Éditeur :
Taylor & Francis Inc
ISBN :
9781574446746
Date de publication :
22 févr. 2006
Dimensions :
24,1 x 17,1 cm
Poids :
1112 g
Langue :
Anglais
Pays d'origine :
USA
Describes the equipment used in manufacturing for deposition and etching, such as electrochemical deposition equipment used for plating copper. This book emphasizes the measurement of mechanical and thermal properties as well as the use of EELS, energy filtering TEM, and atomic force microscopy.