Interconnect reliability in advanced memory device packaging
Auteur :
Gan, Chong Leong, / Huang, Chen-Yu,
Éditeur :
Springer International Publishing AG
ISBN :
9783031267109
Date de publication :
30 avr. 2024
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Suisse
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously.