Three-dimensional integration of semiconductors: processing, materials, and applications
Éditeur :
Springer International Publishing AG
ISBN :
9783319792552
Date de publication :
28 mars 2019
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Suisse
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.