3d stacked chips: from emerging processes to heterogeneous systems
Éditeur :
Springer International Publishing AG
ISBN :
9783319793054
Date de publication :
26 mai 2018
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Suisse
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.