3d microelectronic packaging: from fundamentals to applications
Éditeur :
Springer International Publishing AG
ISBN :
9783319830865
Date de publication :
13 juil. 2018
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Suisse
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.