Rf and microwave microelectronics packaging ii
Éditeur :
Springer International Publishing AG
ISBN :
9783319847191
Date de publication :
9 juin 2018
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Suisse
It is a companion volume to “RF and Microwave Microelectronics Packaging†(2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics.