Testing of interposer-based 2.5d integrated circuits
Auteur :
Wang, Ran / Chakrabarty, Krishnendu
Éditeur :
Springer International Publishing AG
ISBN :
9783319854618
Date de publication :
9 mai 2018
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Suisse
The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.