Advancements in ai and iot for chip manufacturing and defect prevention
Auteur :
Jain, Rupal
Éditeur :
River Publishers
ISBN :
9788770046817
Date de publication :
25 nov. 2024
Dimensions :
23,4 x 15,6 cm
Poids :
280 g
Langue :
Anglais
Pays d'origine :
Danemark
This is essential reading for semiconductor professionals seeking to expand their knowledge on silicon processes, understand defect prevention, and explore optimizing processes by reducing defects using AI and IoT technologies. It charts a course where semiconductor manufacturing defects are minimized and maximizes productivity.