Electronics packaging forum: volume one
Auteur :
Morris, James E.
Éditeur :
Springer
ISBN :
9789401092883
Date de publication :
6 mai 2012
Dimensions :
22,9 x 15,2 cm
Langue :
Anglais
Pays d'origine :
Nederlands
The Materials Research Society and other professional scientific groups have introduced Electronics Packaging sessions into their conference programs, and the International Electronics Packaging Society (IEPS) is expanding rapidly.