Electrical design of through silicon via
Éditeur :
Springer
ISBN :
9789401779494
Date de publication :
27 sept. 2016
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Nederlands
This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity.