Research on chemical mechanical polishing mechanism of novel diffusion barrier ru for cu interconnect
Auteur :
Cheng, Jie
Éditeur :
Springer Verlag, Singapore
ISBN :
9789811355851
Date de publication :
30 janv. 2019
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Singapour
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material.