Modeling and application of electromagnetic and thermal field in electrical engineering
Éditeur :
Springer Verlag, Singapore
ISBN :
9789811501722
Date de publication :
16 déc. 2019
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Singapour
Co-authored by an international research group with a long-standing cooperation, this book focuses on engineering-oriented electromagnetic and thermal field modeling and application.