Micro-electronics and telecommunication engineering: proceedings of 3rd icmete 2019
Éditeur :
Springer Verlag, Singapore
ISBN :
9789811523311
Date de publication :
3 avr. 2021
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Singapour
This book presents selected papers from the 3rd International Conference on Micro-Electronics and Telecommunication Engineering, held at SRM Institute of Science and Technology, Ghaziabad, India, on 30-31 August 2019.