Modelling, simulation and intelligent computing: proceedings of mosicom 2020
Éditeur :
Springer Verlag, Singapore
ISBN :
9789811547775
Date de publication :
30 juil. 2021
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Singapour
This book presents articles from the International Conference on Modelling, Simulation and Intelligent Computing (MoSICom 2020), held at Birla Institute of Technology and Science Pilani, Dubai Campus, Dubai, UAE, in January 2020.