Encyclopedia of thermal packaging: set 3: thermal packaging applications: (a 3–volume set)
Éditeur :
World Scientific Publishing Co Pte Ltd
ISBN :
9789813239661
Date de publication :
30 juil. 2018
Langue :
Anglais
Pays d'origine :
Singapour
Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years.