Thermal imaging in biosystems engineering: principles and applications
Éditeur :
Springer Verlag, Singapore
ISBN :
9789819231461
Date de publication :
28 oct. 2026
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Singapour
This book provides an overview of infrared thermal imaging as an advanced, non-contact, and non-destructive tool in biosystems engineering.