Thermoplasmonics: from principles, materials and characterization to engineering applications
Auteur :
Liu, Guohua
Éditeur :
Springer Verlag, Singapore
ISBN :
9789819783311
Date de publication :
22 nov. 2024
Dimensions :
23,5 x 15,5 cm
Langue :
Anglais
Pays d'origine :
Singapour
This book is built on the recent advancements in understanding thermoplasmonics and highlights the exciting new directions that are shaping this field.